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Dr. Alberto Castellazzi Gives Student Seminar

Dr. Alberto Castellazzi from the University of Nottingham will give a Student Seminar on Friday, March 16th, in conjunction with IEEE PES/PELSSLC. Dr. Castellazzi's presentation is titled Progress beyond state-of-the-art in solid-state power conversion: solutions, technologies and tools for meeting the challenges of  growing and upcoming applications. His seminar will follow the regular SLC seminar. 

When: Friday, March 16th

What time: 1:15pm to 2:15pm EST

Where: MHK 124

Title: Progress beyond state-of-the-art in solid-state power conversion: solutions, technologies and tools for meeting the challenges of  growing and upcoming applications

Abstract: It is widely acknowledged that power electronics will be ubiquitous in future electrical energy systems, underpinning some of the most strategic elements of societal infrastructure: energy generation, transmission and distribution; transportation; industrial equipment and machinery. Next to the substantial forecast growth in already established applications, a number of upcoming and rapidly developing domains are posing novel and demanding requirements. Progress beyond state-of-the-art has traditionally been driven by joint improvement of efficiency, power density and reliability, a challenging undertaking in view of conflicting underlying technological needs. More recently, availability and preventive maintenance capability have also grown in importance. This talk will present enabling research activities and results.       

Bio: Alberto Castellazzi is Associate Professor of Power Electronics at the University of Nottingham, UK. He has been active in power electronics R&D for about 20 years, collaborating with some of the most renowned industrial and academic institutes worldwide. His research interests are power devices and the enabling technologies of power electronics. He has published over 180 papers in peer reviewed journals and conference proceedings and has held a number of invited talks on wide-band-gap semiconductors and their packaging at international specialist events. He is a member of the Technical Programme Committee of the ESREF, ESTC, IRPS and ISPSD conferences, heading the Packaging sub-committee in the latter.


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